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Classroom Contents
Tackling Capacity and Density Challenges by Electro-Photonic Integration - Benny P. Mikkelsen - OFC
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- 1 Intro
- 2 Traffic and Spending Trends
- 3 Space and Power Trends
- 4 Integration Tackles Capacity, Size, Power and Cost Challenges
- 5 Characteristics of Electronic and Photonic Integration
- 6 Types of Electro-Photonic Integration
- 7 The Journey of a Bit Through the Wired Network
- 8 Capacity and Density Challenges, and Trends in Transport
- 9 Coherent is the ideal Application of Electro-Photonic Integration
- 10 Two Material Systems for Photonic Integration
- 11 Integration Achievements in Transport
- 12 Trends in Coherent Transceivers
- 13 How Electro-Photonic Integrations Tackles Challenges in Transport
- 14 Future Transport Trends Benefiting from Electro-Photonic Integration
- 15 The Journey on Campus and inside the Data Center (non-DWDM)
- 16 Multilevel and Coherent Penetrating Shorter Reach
- 17 The Journey from the Switch to the Front Panel
- 18 50Tbps Switch with Co-packaged Optics Saves Power and Space
